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1 features supports defense, aerospace, description cd4504b-ep www.ti.com .......................................................................................................................................................................................... schs369 ? november 2008 cmos hex voltage-level shifter for ttl-to-cmos or cmos-to-cmos operation and medical applications independence of power-supply sequence controlled baseline considerations ? v cc can exceed v dd ; input signals can exceed both v cc and v dd one assembly/test site one fabrication site up and down level-shifting capability available in military ( ? 55 c/125 c) shiftable input threshold for either cmos or temperature range (1) ttl compatibility extended product life cycle standardized symmetrical output extended product-change notification characteristics product traceability 100% tested for quiescent current at 20 v maximum input current of 1 m a at 18 v over full package-temperature range: 100 na at 18 v and 25 c 5 v, 10 v, and 15 v parametric ratings meets all requirements of jedec standard no. 13b, "standard specifications for description of 'b' series cmos devices" (1) additional temperature ranges are available ? contact factory cd4504b hex voltage level-shifter consists of six circuits which shift input signals from the v cc logic level to the v dd logic level. to shift ttl signals to cmos logic levels, the select input is at the v cc high logic state. when the select input is at a low logic state, each circuit translates signals from one cmos level to another. ordering information (1) t a package (2) orderable part number top-side marking ? 55 c to 125 c tssop ? pw reel of 2000 cd4504bmpwrep 4504bep (1) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com . 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2008, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 12 3 4 5 6 7 8 1615 14 13 12 11 10 9 v cc a out a in b out b in c out c in v ss v dd f out f in selecte out e in d out d in (to p v ie w )
absolute maximum ratings cd4504b-ep schs369 ? november 2008 .......................................................................................................................................................................................... www.ti.com functional block diagram over operating free-air temperature range (unless otherwise noted) min max unit v dd dc supply-voltage range, voltages referenced to v ss terminal ? 0.5 +20 v input voltage range, all inputs ? 0.5 v cc + 0.5 v dc input current, any one input 10 ma t a = ? 55 c to +100 c 500 mw p d power dissipation per package derate linearly at 12 mw/ c to t a = +100 c to +125 c 200 nw device dissipation per output transistor, 100 mw for ta = full package-temperature range (all package types) t a operating temperature range ? 55 +125 c q ja package thermal impedance (1) 91.1 c/w t stg storage temperature range ? 85 +150 c lead temperature (during soldering), at distance 1/16 1/32 inch (1.59 0.79 mm) from case for +265 c 10 s max (1) the package thermal impedance is calculated in accordance with jesd 51-7. 2 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): cd4504b-ep
static electrical characteristics cd4504b-ep www.ti.com .......................................................................................................................................................................................... schs369 ? november 2008 over operating free-air temperature range (unless otherwise noted) conditions limits at indicated temperatures ( c) characteristic +25 unit v o v in v cc v cc ? 55 ? 40 +85 +125 (v) (v) (v) (v) min typ max 0, 5 5 5 1.5 1.5 1.5 1.5 0.02 1.5 ma 0, 10 5 10 2 2 2 2 0.02 2 quiescent device current, i dd max and i cc in cmos-cmos mode 0, 15 5 15 4 4 120 120 0.02 4 m a 0, 20 5 20 20 20 600 600 0.04 20 0, 5 5 5 5 5 6 6 2.5 5 quiescent device current, 0, 10 5 10 5 5 6 6 2.5 5 ma i cc max ttl-cmos mode 0, 15 5 15 5 5 6 6 2.5 5 0.4 0, 5 5 0.64 0.61 0.42 0.36 0.51 1 output low (sink) current, 0.5 0, 10 10 1.6 1.5 1.1 0.9 1.3 2.6 i ol min 1.5 0, 15 15 4.2 4 2.8 2.4 3.4 6.8 4.6 0, 5 5 ? 0.64 ? 0.61 ? 0.42 ? 0.36 ? 0.51 ? 1 ma 2.5 0, 5 5 ? 2 ? 1.8 ? 1.3 ? 1.15 ? 1.6 ? 3.2 output high (source) current, i oh min 9.5 0, 10 10 ? 1.6 ? 1.5 ? 1.1 ? 0.9 ? 1.3 ? 2.6 13.5 0, 15 15 ? 4.2 ? 4 ? 2.8 ? 2.4 ? 3.4 ? 6.8 0, 5 5 0.05 0 0.05 output voltage: 0, 10 10 0.05 0 0.05 low-level, v ol max 0, 15 15 0.05 0 0.05 0, 5 5 4.95 4.95 5 output voltage: 0, 10 10 9.95 9.95 10 high-level, v oh min 0, 15 15 14.95 14.95 15 ttl-cmos 1 5 10 0.8 0.8 ttl-cmos 1 5 15 0.8 0.8 v input low voltage, cmos-cmos 1 5 10 1.5 1.5 v il max (1) cmos-cmos 1.5 5 15 1.5 1.5 cmos-cmos 1.5 10 15 3 3 ttl-cmos 9 5 10 2 2 ttl-cmos 13.5 5 15 2 2 input high voltage, cmos-cmos 9 5 10 3.5 3.5 v ih min (1) cmos-cmos 13.5 5 15 3.5 3.5 cmos-cmos 13.5 10 15 7 7 input current, i in max 0, 18 18 0.1 0.1 1 1 10 ? 5 0.1 m a (1) applies to the six input signals. for mode control (p13), only the cmos-cmos ratings apply. copyright ? 2008, texas instruments incorporated submit documentation feedback 3 product folder link(s): cd4504b-ep
cd4504b-ep schs369 ? november 2008 .......................................................................................................................................................................................... www.ti.com figure 1. typical output low (sink) current characteristics figure 2. minimum output low (sink) current characteristics figure 3. typical output high (source) current characteristics 4 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): cd4504b-ep
cd4504b-ep www.ti.com .......................................................................................................................................................................................... schs369 ? november 2008 figure 4. minimum output high (source) current characteristics copyright ? 2008, texas instruments incorporated submit documentation feedback 5 product folder link(s): cd4504b-ep
recommended operating conditions dynamic electrical characteristics cd4504b-ep schs369 ? november 2008 .......................................................................................................................................................................................... www.ti.com for maximum reliability, nominal operating conditions should be selected so that operation is always within the following ranges: characteristic min max unit v dd supply-voltage range (for t a = full package temperature range) 5 18 v t a = 25 c, input t r ,t f = 20 ns, c l = 50 pf, r l = 200 ? limits v cc v dd characteristic shifting mode unit (v) (v) typ max 5 10 140 280 ttl to cmos v dd > v cc 5 15 140 280 5 10 120 240 cmos to cmos 5 15 120 240 v dd > v cc t phl propagation delay: high-to-low, ns 10 15 70 140 10 5 275 550 cmos to cmos 15 5 275 550 v cc > v dd 15 10 70 140 5 10 140 280 ttl to cmos v dd > v cc 5 15 140 280 5 10 120 240 cmos to cmos 5 15 120 240 v dd > v cc t plh propagation delay: low-to-high ns 10 15 70 140 10 5 200 400 cmos to cmos 15 5 200 400 v cc > v dd 15 10 60 120 5 100 200 t thl , t tlh transition time all modes 10 50 100 ns 15 40 80 c in input capacitance any input 5 7.5 pf figure 5. quiescent device current 6 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): cd4504b-ep
cd4504b-ep www.ti.com .......................................................................................................................................................................................... schs369 ? november 2008 figure 6. input current figure 7. input voltage figure 8. typical input switching as a function of figure 9. typical input switching as a function of high-level supply voltage (select at v cc ? cmos high-level supply voltage (select at v ss ? ttl mode) mode copyright ? 2008, texas instruments incorporated submit documentation feedback 7 product folder link(s): cd4504b-ep
cd4504b-ep schs369 ? november 2008 .......................................................................................................................................................................................... www.ti.com figure 10. high-level supply voltage vs. low-level supply voltage a. dimensions in parentheses are in millimeters and are derived form the basic inch dimensions as indicated. grid graduations are in mils (10 ? 3 inch). figure 11. dimensions and pad layout 8 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): cd4504b-ep
package option addendum www.ti.com 31-may-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples cd4504bmpwrep active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 4504bep v62/09606-01xe active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 4504bep (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 31-may-2014 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of cd4504b-ep : ? catalog: cd4504b ? military: cd4504b-mil note: qualified version definitions: ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant cd4504bmpwrep tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 package materials information www.ti.com 26-jan-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) cd4504bmpwrep tssop pw 16 2000 367.0 367.0 35.0 package materials information www.ti.com 26-jan-2013 pack materials-page 2

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